During the initial talks, the companies gave encouraging responses. The government is placing a priority on preparing and entering the MoU as quickly as possible. In addition to facilitating the MoU, the demands of the investors will also be met, including providing them with the desired location, land, policy framework, and incentive schemes for specific projects.
Tokyo [Japan], June 25 (ANI): Japanese electronic parts companies have the technology to make various electronic substrates. This electronic substrate for the electric product is required to be shaped, miniature as it is applicable to multiple uses.